| Technology Item | Current Process Capability | On-going Development |
|---|---|---|
| Layer Count | 2~6 Layers | 8~12 Layers |
| Min. Finished Hole Size | 0.2 mm | 0.15 mm |
| Max. Aspect Ratio | 6:01 | 8:01 |
| Min. Board Thickness (Final) | 0.6 mm | 0.4 mm |
| Max. Board Thickness (Final) | 2.0 mm | 3.0 mm |
| Min. Core Thickness | 0.1 mm (Exclude Copper) | 0.075 mm (Exclude Copper) |
| Min. Copper Thickness | 0.5 oz | 0.33 oz |
| Max. Copper Thickness | 2 oz | 3 oz |
| Min. Internal Layer Trace/Space | 0.1 / 0.1 mm(4/4 mil) | 0.075 / 0.075 mm (3/3 mil) |
| Min Outer Layer Trace/Space | 0.1 / 0.1 mm(4/4 mil) | 0.075 / 0.075 mm (3/3 mil) |
| Min SMD Size | 0.2 mm (8 mil) | 0.15 mm (6 mil) |
| Min. SMD Pitch | 0.4 mm (16 mil) | 0.35 mm (14 mil) |
| Hole Registration Tolerance | 0.1 mm | 0.075 mm |
| Image Registration Tolerance | 0.05 mm | 0.05 mm |
| Solder Mask Registration Tolerance | 0.05 mm | 0.05 mm |
| Min. Solder Dam | 3 mil (0.075 mm) | 2 mil (0.05 mm) |
| Impedance Control | 10% | 8% |
| Blind Hole and Bury Hole | No | yes |
| PCB Warp and Twist | 0.5% | 0.5% |
RICHMOND PCB COMPANY LIMITED
ROOM 1202, 12/F, HON KWOK JORDAN CTR
7 HILLWOOD ROAD, TSIM SHA TSUI
HONG KONG
TEL 852-36902262
FAX 852-36902263
Mr. JEROME WONG